TAJIMA TEMX-C Series, Руководство пользователя

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To set details of the device
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Chapter 8
RR07
2.
To set details of the device
2-1.
Sequin Device IV
Set the detail of the device.
2-1-1.
Explanation on the screen
[a]
Feed amount of sequin chips for the device at the left side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[b]
Feed amount of sequin chips for the device at the right side
Select a value that adds about 1.0 to an external diameter of chip as a rough standard.
[c]
Insertion of jump data when a sequin chip is sewn on
Select "YES" when sequin chips are not sewn effectually. However, productivity will be
decreased.
YES: To perform
NO: Not to perform
[d]
Moving up of device at frame stepping
YES: To perform
NO: Not to perform
[e]
Feed out sequin chips one by one by manual operation. (p.189)
Feed amount is the value selected at above [a] or [b].
L: Device at the left side
R: Device at the right side
Selecting "NO" will increase manufacturing efficiency. However, the device
could interfere with the frame resulting in its breakage depending on design or
frame type to use.
F3
2 Sequin
NO
YES/NO
Jump insertion
YES
Device Up at
YES/NO
4.0
4.0
Sequin (L)
Sequin (R)
[mm]
2.0 23.0
[mm]
2.0 23.0
[a]
Setting of device at the left side
[b]
Setting of device at the right side
[c]
Jump insertion
[d]
Moving up of device
Sequin Chip
Feed
[e]
Feed out sequin chips one by one.
frame stepping
!
CAUTION