S3C2500B
PRODUCT OVERVIEW
1-17
Table 1-1. S3C2500B Signal Descriptions (Continue)
Group
Pin Name
Pin
Type
Pad Type
Description
Memory
Interface
(80)
XBMREQ
1
I
phicd
External Master bus request.
An external bus master uses this pin to
request the external bus. When it activates the
XBMREQ, the S3C2500B drives the state of
external bus pins to high impedance. This lets
the external bus master take control of the
external bus. When it has control, the external
bus master assumes responsibity for SDRAM
refresh operation. The XBMREQ is
deactivated when the external bus master
releases the external bus. When this occurs,
the S3C2500B can get the control of the bus
and the XBMACK goes “low”.
XBMACK
1
O
phob8
External bus Acknowledge.
TAP
Control
(5)
TCK
1
I
phic
JTAG Test Clock.
The JTAG test clock shifts state information
and test data into, and out of, the S3C2500B
during JTAG test operations.
TMS
1
I
phicu
JTAG Test Mode Select.
This pin controls JTAG test operations in the
S3C2500B. This pin is internally connected
pull-up.
TDI
1
I
phicu
JTAG Test Data In.
The TDI level is used to serially shift test data
and instructions into the S3C2500B during
JTAG test operations. This pin is internally
connected pull-up.
TDO
1
O
phot12
JTAG Test Data Out.
The TDO level is used to serially shift test
data and instructions out of the S3C2500B
during JTAG test operations.
nTRST
1
I
phicu
JTAG Not Reset.
Asynchronous reset of the JTAG logic.
This pin is internally connected pull-up.
Содержание S3C2500B
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