17. Power-Down Mode
Rev.1.00 Jan. 10, 2008 Page 782 of 1658
REJ09B0261-0100
Table 17.1 States of Power-Down Modes
State
On-Chip Peripheral Module
Power-
Down
Mode
Conditions of
Transition
CPG CPU
On-Chip
Memory
DMAC GDTA Others Pin DDR2-SDRAM
Releasing
Methods
Sleep
mode
SLEEP
instruction
executed (see
section 17.4)
Operate Stopped
(contents
of registers
retained)
Retained Operate Operate Operate Operation
retained
Auto-refresh or
self-refresh
*
3
1. Interrupt
2. Power-on
reset
3. Manual
reset
Deep
sleep
mode
Corresponding
bit in MSTPCR
set to 1 (see
section 17.3.2)
Operate Stopped
(contents
of registers
retained)
Retained Stopped
(contents
of
registers
retained)
Stopped
(contents
of
registers
retained)
Operate
(DU,
TMU,
SCIF,
SIOF,
HSPI,
MMCIF,
HAC,
SSI,
FLCTL,
and UBC
are
stopped
*
1
)
Operation
retained
Self-refresh 1.
Interrupt
2. Power-on
reset
3. Manual
reset
Module
standby
function
Clear the
corresponding
bits in
MSTPCR0 and
MSTPCR1 to 0
(see sections
17.3.2 and
17.3.3)
Operate Operate Retained Stopped
in six-
channel
units:
channels
0 to 5 and
channels
6 to 11.
Stopped Specified
modules
stopped
Operation
retained
Auto-refresh or
self-refresh
Clear the
corresponding
bits in
MSTPCR0 and
MSTPCR1 to 0
(see sections
17.3.2 and
17.3.3)
DDR2-
SDRAM
power
supply
backup
*
2
See section
17.7
Stopped Stopped Undefined
Stopped
Stopped
Stopped
Undefined
except for the
1.8-V power
supply
interface
(When the
MBKPRST
is
low level input,
the MCKE is
high level
output)
Self-refresh Power-on
reset
Notes: 1. The TMU, SCIF, SIOF, HSPI, MMCIF, HAC, SSI, FLCTL and UBC should be in module
stop state by using the module standby function before execute the SLEEP instruction
to make transition to deep sleep mode. For detail, refer to section 17.5, Deep Sleep
Mode.
2. Power supplies (1.1 V, 3.3 V) except the 1.8 V power supply are stopped in DDR2-
SDRAM power supply backup mode. Therefore, all circuitry other than the pad of DDR2
interface are stopped, including DDR2 interface control unit, and the contents of
registers are not retained.
3. For details on auto-refresh and self-refresh operation, see section 12, DDR2-SDRAM
Interface (DBSC2).
Содержание SH7781
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