
ML610471/472/473/Q471/Q472/Q473 User's Manual
Appendix B Package Dimensions
Appendix B-2
48 pin TQFP Package
P-TQFP48-0707-0.50-K
Package material
Epoxy resin
Lead frame material
42 alloy
Lead finish
Sn-2Bi (Bi 2%typ.)
Solder thickness
More than 5
μ
m
Package weight (g)
0.13typ.
Rev. No./Last Revised
3 / Nov. 9,2011
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact ROHM’s responsible sales person for the product name, package name,
pin number, package code and desired mounting conditions (reflow method, temperature and times).
Содержание ML610471
Страница 12: ...Chapter 1 Overview...
Страница 38: ...Chapter 2 CPU and Memory Space...
Страница 44: ...Chapter 3 Reset Function...
Страница 48: ...Chapter 4 MCU Control Function...
Страница 62: ...Chapter 5 Interrupts...
Страница 82: ...Chapter 6 Clock Generation Circuit...
Страница 94: ...Chapter 7 Time Base Counter...
Страница 105: ...Chapter 8 Capture...
Страница 114: ...Chapter 9 Timer...
Страница 133: ...Chapter 10 Watchdog Timer...
Страница 141: ...Chapter 11 UART...
Страница 164: ...Chapter 12 Port 0...
Страница 173: ...Chapter 13 Port 2...
Страница 180: ...Chapter 14 Port 3...
Страница 188: ...Chapter 15 Port 4...
Страница 199: ...Chapter 16 Port 6...
Страница 205: ...Chapter 17 RC Oscillation Type A D Converter...
Страница 225: ...Chapter 18 LCD Drivers...
Страница 243: ...Chapter 19 Power Supply Circuit...
Страница 245: ...Chapter 20 uEASE Flash Writer System...
Страница 249: ...Chapter 21 Software Development...
Страница 258: ...Appendixes...
Страница 280: ...Revision History...