62
JN-DS-JN5142 1v0
© NXP Laboratories UK 2012
Internal RESET
RESETN
V
RST
t
STAB
t
RST
Figure 41: Externally Applied Reset
VDD = 2.0 to 3.6V, -40 to +125º C
Parameter
Min
Typ
Max
Unit
Notes
External Reset pulse width
to initiate reset sequence
(t
RST
)
1
µs
Assumes internal
pullup resistor value of
100K worst case and
~5pF external
capacitance
External Reset threshold
voltage (V
RST
)
VDD2 x
0.7
V
Minimum voltage to
avoid being reset
Internal Power-on Reset
threshold voltage (V
POT
)
Rise/fall time > 10mS
1.47
1.42
V
Rising
Falling
Spike Rejection
Square wave pulse 1us
Triangular wave pulse 10us
1.2
1.3
V
Depth of pulse to
trigger reset
Reset stabilisation time
(t
STAB
)
45
µs
Note 1
Supply Voltage Monitor
Threshold Voltage (V
TH
)
1.88
1.92
2.03
2.12
2.22
2.31
2.60
2.89
1.96
2.00
2.11
2.21
2.31
2.41
2.71
3.01
2.02
2.06
2.17
2.28
2.38
2.48
2.79
3.10
V
Configurable threshold
with 8 levels
Supply Voltage Monitor
Hysteresis (V
HYS
)
43
46
50
57
63
70
85
100
mV
Corresponding to the 8
threshold levels
1
Time from release of reset to start of executing ROM code. Loading program from Flash occurs in addition to this.