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Kintex Ult FPGA (KU19P) SOM Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
3.2.4
Heat Sink
For any highly integrated System on Modules, thermal design is very important factor. As IC’s size is decreasing and
performance of module is increasing by rising processor frequencies, it generates high amount of heat which should
be dissipated for the system to work as expected without fault.
To dissipate the heat, appropriate thermal management technique Heat sink must be used. Always remember that, if
you use more effective thermal solution, you will get more performance out of the CPU.
Figure 10: Heat Sink