Intel® Server System M50FCP1UR System Integration and Service Guide
63
6.5
Processor Replacement
Components Required:
•
New 4
th
Gen Intel® Xeon® Scalable pro included shipping tray
•
Existing processor carrier clip
•
Existing 1U standard heat sink or 1U
Enhanced Volume Air Cooling
(EVAC) heat sink + new thermal
interface material (TIM)
Required Tools and Supplies
•
Anti-static wrist strap and conductive workbench pad (recommended)
•
ESD Gloves (recommended)
•
T-30 Torx* screwdriver
•
Phillips* head screwdriver #2
Note:
The following sections show the EVAC heat sink in the figures. The procedures described apply to both
heat sink types.
Caution:
Fin edges of the processor heat sink are very sharp. Intel recommends wearing thin ESD protective
gloves when handling the PHM during the following procedures.
Caution:
Processor heat sinks are easily damaged if handled improperly. See the following figure for proper
handling.
Figure 74. Processor Heat Sink Handling
Two types of processor carrier clips are supported by the 4
th
Gen Intel® Xeon® Scalable processor family for
this server product family, they are identified as “E1A” and “E1B”.
E1A Processor Carrier Clip
E1B Processor Carrier Clip
Figure 75. Supported Processor Carrier Clips
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