Intel 845GE, Руководство по тепловому проектированию

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Product Specifications
R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide 11
2 Product Specifications
2.1 Package Description
2.1.1 Intel
®
(G)MCH Package Dimensions
The 82845GE GMCH and 82845PE MCH are in a 37.5 mm x 37.5 mm, 760 FC-BGA package
(see Appendix A).
2.2 Heatsink and Clip Mechanical Reference Design
The reference heatsink solution is a passive extruded aluminum heatsink with thermal and
mechanical interfaces. It is attached using a clip frame and mechanical advantage lever. The clip
frame is secured to the system board via four solder down anchors in four locations around the
(G)MCH.
The heatsink clip for the (G)MCH is designed to be used in conjunction with the mechanical
attach solution for the Intel
®
Pentium
®
4 processor. The clip provides a mechanical preload
applied to the heatsink and package via a mechanical advantage lever. This preload assures
minimal bond line thickness and adds rigidity to the heatsink and package assembly. The clip is
designed to prevent component damage and potential failures under environmental system
loading.
2.2.1 Mechanical Keep-Outs
The mechanical keep-out restrictions are included in Appendix A (Figure 14). The component
height restrictions are illustrated by a legend in the drawing. It is important to note that the keep-
out and height restrictions differ slightly from the Intel
®
82845 chipset keep-outs.