Intel 845GE, Руководство по тепловому проектированию

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Product Specifications
R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide 13
2.3 Thermal and Mechanical Reliability
Recommendations for thermal mechanical reliability testing are shown in Table 2. These should
be considered as general guidelines. The user, based on anticipated use conditions, should define
validation testing requirements.
Table 2. Reliability Validation
Test
1
Requirement Pass/Fail Criteria
2
Mechanical
Shock
•
Quantity: 3 drops for + and - directions in each of 3
perpendicular axes (i.e., total 18 drops).
•
Profile: 50 G trapezoidal waveform, 11 ms duration,
170 inches/sec minimum velocity change.
•
Setup: Mount sample board on test fixture.
Visual\Electrical
Check
Random
Vibration
•
Duration: 10 min/axis, 3 axes
•
Frequency Range: 5 Hz to 500 Hz
•
Power Spectral Density (PSD) Profile: 3.13 g RMS
Visual/Electrical
Check
Thermal
Cycling
•
-5
°
C to +70
°
C, 500 cycles Visual Check
Unbiased
Humidity
•
85 % relative humidity / 55
°
C, 1000 hours
Visual Check
Power Cycling
•
7,500 on/off cycles with each cycle specified as 3 minutes on,
2 minutes off 70
°
C
Visual Check
NOTES:
1. The above tests should be performed on a sample size of at least 12 assemblies from 3 different lots of
material.
2. Additional Pass/Fail Criteria may be added at the discretion of the user.