Intel 845GE, Руководство по тепловому проектированию

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Introduction
R
8 Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide
Table 1. Specification Summary
Package Dimensions
(G)MCH 37.5 mm x 37.5 mm x 2.54 mm
Handling Keep out on Substrate
(G)MCH 2 mm from edge of die
Max Allowable Die Pressure
(G)MCH 400 kPa (this corresponds to 50 lbf load on die)
Heatsink Volume Keep outs
(G)MCH Heatsink X:37.5 mm, Y:37.5 mm, Z:40 mm
Operating Environment
Maximum (G)MCH Local Ambient Temperature (T
A
)
Assumption [For use with Intel
®
Pentium
®
4
Processors at or below the flexible motherboard 1
(FMB1) target.]
53
°
C
Maximum (G)MCH Local Ambient Temperature
Assumption [For use with Intel® Pentium® 4
Processors at or below the flexible motherboard 2
(FMB2) target.] 50
°
C
Minimum Airflow 50 lfm
Thermal Design Power (TDP)
82845PE MCH 5.6 W (333 MHz DDR, 533 MHz FSB, Discrete
Graphics)
82845GE GMCH 6.3 W (333 MHz DDR, 533 MHz FSB, w/ Integrated
Graphics)
(G)MCH Maximum Case Temperature
(G)MCH 92
°
C