Intel 845GE, Руководство по тепловому проектированию

Страница: 23 / 31

Generic Thermal Attach / Mechanical Solution
R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide 23
4 Generic Thermal Attach /
Mechanical Solution
The heatsink is affixed to the die with a mechanism advantage clip. The clip consists of a clip
frame that interfaces to the motherboard through four through-hole mount anchors and an
integral lever (see Figure 2). The clip and lever serve three main purposes: to secure the heatsink
in intimate contact with the die, to ensure a thermally good bondline between the heatsink and
die, and to prevent damage at the package-to-motherboard solder joint during mechanical shock
events.
4.1 Heatsink Retention
The heatsink must maintain close contact with the die for the life of the system. The generic clip
retention mechanism design holds the heatsink to the die through a single point contact at the
center of the heatsink. This ensures that the clip load is centered on the die, thus preventing
heatsink tilt that may be caused by unbalanced loading (see Figure 9). The clip frame also
restrains heatsink lateral motion through tabs located between the heatsink fins (see Figure 10).
Figure 9. Intel
®
(G)MCH Clip Assembly
Clip Tabs
Note: The heatsink has two
slightly larger alignment
channels. This symmetry is to
facilitate ease clip of assembly
and HS orientation.
Clip Tabs
Note: The heatsink has two
slightly larger alignment
channels. This symmetry is to
facilitate ease clip of assembly
and HS orientation.