Intel 845GE, Руководство по тепловому проектированию

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Product Specifications
R
18 Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide
component’s datasheet for the I
CC
(Max Power Supply Current) specification. Contact your Intel
Field Sales representative to obtain a copy of this software.
Figure 7. 0 Degree Thermal Solution Decision Flowchart for 0 °C
flowchart
Attach thermocouples using
recommended metrology.
Setup the system in the
desired configuration.
No
Yes
Heatsink
required
Select
Heatsink
End
Start
Run the Power
program and
monitor the device
die temperature.
Attach device to
board using normal
reflow process.
Tdie >
Specification?
2.7 Intel
®
(G)MCH Thermal Design Power
The 845GE/845PE chipset power utility is designed to dissipate the TDP power value through
the (G)MCH when a system is populated with the memory listed in Table 5. These values have
been validated for the configurations below running the Processor System Bus frequency at 400
MHz.
Table 5. Intel
®
82845PE MCH Thermal Design Power
TDP (Watts) System Configuration
5.6 W 333 MHz DDR, 533 MHz FSB, Discrete Graphics
Table 6. Intel
®
82845GE GMCH Thermal Design Power
TDP (Watts) System Configuration
6.3 W 333 MHz DDR, 533 MHz FSB, w/ 266 MHz Integrated Graphics