Intel 845GE, Руководство по тепловому проектированию

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Introduction
R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide 9
1.1 Definition of Terms
Term Definition
BGA Ball Grid Array. A package type defined by a resin-fiber substrate where a die is mounted,
bonded and encapsulated in molding compound. The primary electrical interface is an array of
solder balls attached to the substrate opposite the die and molding compound.
CFD Computational Fluid Dynamics.
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a die is mounted
using an underfill C4 (Controlled Collapse Chip Connection) attach style. The primary electrical
interface is an array of solder balls attached to the substrate opposite the die. Note that the
device arrives at the customer with solder balls attached (see Figure 8)
ICH4 I/O Controller Hub. The chipset component that contains the primary PCI interface, LPC
interface, USB, ATA-33, and other legacy functions.
EBGA Mini Ball Grid Array. A smaller version of the BGA with a ball pitch of 1.00 mm.
GMCH Graphic Memory Controller Hub. The chipset component that contains the processor and
memory interface and an integrated graphics device.
MCH Memory Controller Hub. The chipset component that contains the processor and memory
interface.
OLGA Organic Land Grid Array.
T
A
The measured ambient temperature locally to the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive heatsink or at the fan
inlet for an active heatsink.
T
C
The measured case temperature of a component. For processors, it is measured at the
geometric center of the integrated heat spreader (IHS). For other component types, it is
generally measured at the geometric center of the die or case.
T
C-MAX
The maximum case/die temperature with an attached heatsink. This temperature is measured at
the geometric center of the top of the package case/die.
TDP Thermal Design Power. Thermal solutions should be designed to dissipate this target power
level. Thermal Design Power (typical) is specified as the highest sustainable power level of most
or all of the real applications expected to be run on the given product, based on extrapolations in
both hardware and software technology over the life of the component. Thermal solutions should
be designed to dissipate this target power level.
TIM Thermal Interface Material. This material is designed to fill surface voids between the die and
heatsink surfaces in order to facilitate heat transfer.
lfm Linear Feet per Minute. Units of mass flow for fluids
TRHS Thermal Resistance of Heatsink.
TOP Thermal Operating Point. The TOP is defined as the thermal resistance of the thermal interface
material loaded at the design force of the clip and retention mechanism plus the thermal
resistance of the heatsink at the specified airflow speed.