Intel 845GE, Руководство по тепловому проектированию

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R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide 3
Contents
1 Introduction.....................................................................................................................7
1.1 Definition of Terms .............................................................................................9
2 Product Specifications ..................................................................................................11
2.1 Package Description .........................................................................................11
2.1.1 Intel
®
(G)MCH Package Dimensions..................................................11
2.2 Heatsink and Clip Mechanical Reference Design ..............................................11
2.2.1 Mechanical Keep-Outs.......................................................................11
2.2.2 Heatsink Assembly ............................................................................12
2.3 Thermal and Mechanical Reliability ..................................................................13
2.4 Thermal Specifications .....................................................................................14
2.4.1 External Ambient Conditions..............................................................14
2.4.2 Maximum Case Temperature.............................................................15
2.5 Temperature Measurement Metrology ..............................................................15
2.5.1 Case Temperature Measurements .....................................................15
2.5.2 90 Degree Angle Attach Methodology ................................................15
2.5.3 0 Degree Angle Attach Methodology ..................................................16
2.6 Power Dissipation Software ..............................................................................17
2.7 Intel
®
(G)MCH Thermal Design Power ..............................................................18
3 Generic Thermal Solution .............................................................................................19
3.1 Generic Thermal Solution Performance ............................................................19
3.2 Generic Thermal Solution TIM Description........................................................19
3.2.1 The Effect of Pressure on TIM Performance ......................................19
3.3 Generic Thermal Solution Thermal Operating Point ..........................................20
3.4 Generic Thermal Solution Simulation................................................................20
3.4.1 Flotherm Model Implementation in a System Level Analysis..............21
3.4.2 System Model Grid ............................................................................21
3.4.3 Thermal Model Power Dissipation......................................................21
4 Generic Thermal Attach / Mechanical Solution..............................................................23
4.1 Heatsink Retention............................................................................................23
4.2 Thermal Bond Line ...........................................................................................24
4.3 Solder Joint Protection......................................................................................24
4.4 Intel
®
(G)MCH Heatsink Drawings.....................................................................25
5 Vendors ........................................................................................................................27
5.1 Heatsink Suppliers ............................................................................................27
Appendix A: Package Dimensions .......................................................................................................29