Intel 845GE, Руководство по тепловому проектированию

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Product Specifications
R
Intel
®
845GE / 845PE Chipset (G)MCH Thermal Design Guide 17
Figure 5. 0 Degree Angle Attach Heatsink Modifications (not to scale)
Angle_Attach_Heatsink_Mod
1.3 mm (0.05 in.)
(0.5 mm (0.02 in.) Depth)
3.3 mm (0.13 in.) Diameter
(1.5 mm (0.06 in.) Depth)
Figure 6. 0 Degree Angle Attach Methodology (not to scale)
angle_attac h_1
T herm ocouple W ire
D ie
C em ent +
T herm ocouple Bead
Substrate
2.6 Power Dissipation Software
The power simulation software is a utility designed to dissipate the Thermal Design Power
(TDP) on the (G)MCH when used in conjunction with an Intel
®
Pentium 4 processor. The
combination of the Intel
®
Pentium 4 processor and the bandwidth capability of the (G)MCH
enable new levels of system performance. To assess the thermal performance of the
845GE/845PE chipset generic thermal solution during “worst-case realistic application”
conditions, Intel has developed a software utility that operates the chipset at near worst-case
power dissipation.
The utility has been developed solely for testing customer thermal solutions at or near the
thermal design power. Figure 7 shows a decision flowchart for determining thermal solution
needs. Real future applications may exceed the thermal design power limit for transient time
periods. For power supply current requirements under these transient conditions, refer to each