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Product Specifications

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12

Intel

®

845GE / 845PE Chipset (G)MCH Thermal Design Guide

2.2.2 Heatsink

Assembly

The heatsink assembly includes the heatsink (with TIM and mechanical interface gasket), the
clip, and clip lever as shown in Figure 1. This clip attaches to solder down anchors located on
the system board.

Figure 1. Heatsink Assembly: Heatsink, Clip Frame, Clip Lever

Figure 2. Heatsink Assembly Placement and Actuation

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Содержание 845GE

Страница 1: ...Intel 845PE 845GE Chipset Thermal Design Guide Intel 82845GE GMCH Intel 82845PE MCH Thermal and Mechanical Design Guidelines September 2006 Document Number 251926 002 R...

Страница 2: ...o specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserv...

Страница 3: ...dology 15 2 5 3 0 Degree Angle Attach Methodology 16 2 6 Power Dissipation Software 17 2 7 Intel G MCH Thermal Design Power 18 3 Generic Thermal Solution 19 3 1 Generic Thermal Solution Performance 19...

Страница 4: ...MCH Clip Assembly 23 Figure 10 Intel G MCH Clip Lateral Retention Tab Feature 24 Figure 11 Intel G MCH Clip Frame and Lever 25 Figure 12 Intel G MCH FC BGA Package Dimensions Top and Side View 29 Figu...

Страница 5: ...R Intel 845GE 845PE Chipset G MCH Thermal Design Guide 5 Revision History Revision Number Description Date 002 Corrected part number for heatsink September 2006 001 Initial Release October 2002...

Страница 6: ...R 6 Intel 845GE 845PE Chipset G MCH Thermal Design Guide This page is intentionally left blank...

Страница 7: ...olutions The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise This document is for the 845GE and 845PE chipsets The thermal and mechanical design gui...

Страница 8: ...5 mm Z 40 mm Operating Environment Maximum G MCH Local Ambient Temperature TA Assumption For use with Intel Pentium 4 Processors at or below the flexible motherboard 1 FMB1 target 53 C Maximum G MCH...

Страница 9: ...ature locally to the component of interest The ambient temperature should be measured just upstream of airflow for a passive heatsink or at the fan inlet for an active heatsink TC The measured case te...

Страница 10: ...Introduction R 10 Intel 845GE 845PE Chipset G MCH Thermal Design Guide This page is intentionally left blank...

Страница 11: ...ns around the G MCH The heatsink clip for the G MCH is designed to be used in conjunction with the mechanical attach solution for the Intel Pentium 4 processor The clip provides a mechanical preload a...

Страница 12: ...e heatsink assembly includes the heatsink with TIM and mechanical interface gasket the clip and clip lever as shown in Figure 1 This clip attaches to solder down anchors located on the system board Fi...

Страница 13: ...ile 50 G trapezoidal waveform 11 ms duration 170 inches sec minimum velocity change Setup Mount sample board on test fixture Visual Electrical Check Random Vibration Duration 10 min axis 3 axes Freque...

Страница 14: ...ient TA Recommendations Pentium 4 Processor Flexible Mother Board FMB Targets Pentium 4 Processor Local Ambient TA Assumptions G MCH Local Ambient TA Assumptions FMB1 45 C 53 C FMB2 42 C 50 C NOTE The...

Страница 15: ...elines for thermal performance and evaluation 2 5 1 Case Temperature Measurements To ensure functionality and reliability the 82845GE GMCH 82845PE MCH is specified for proper operation when Tcase is m...

Страница 16: ...n parallel to the heatsink fins see Figure 5 and Figure 6 3 Attach thermal interface material TIM to the bottom of the heatsink base 4 Cut out portions of the TIM to make room for the thermocouple wir...

Страница 17: ...l Pentium 4 processor The combination of the Intel Pentium 4 processor and the bandwidth capability of the G MCH enable new levels of system performance To assess the thermal performance of the 845GE...

Страница 18: ...itor the device die temperature Attach device to board using normal reflow process Tdie Specification 2 7 Intel G MCH Thermal Design Power The 845GE 845PE chipset power utility is designed to dissipat...

Страница 19: ...his reduction in junction temperature leads to greater component reliability 3 2 Generic Thermal Solution TIM Description A thermal interface material is used to provide improved conductivity between...

Страница 20: ...on the percentage of TDP that leaves via the top of the package increases see Table 8 Table 8 TDP Dissipation for Various Airflow Speeds Upstream Airflow Speed lfm of TDP Dissipated via Intel Thermal...

Страница 21: ...interface between the solder ball cuboid and the motherboard Ensure that the die cuboid in the chipset model is properly mated to the thermal solution Model the thermal interface material by using a c...

Страница 22: ...Generic Thermal Solution R 22 Intel 845GE 845PE Chipset G MCH Thermal Design Guide This page is intentionally left blank...

Страница 23: ...ts 4 1 Heatsink Retention The heatsink must maintain close contact with the die for the life of the system The generic clip retention mechanism design holds the heatsink to the die through a single po...

Страница 24: ...ical shock conditions depending on the mass and proximity of the processor heatsink Other elements e g motherboard bending rigidity and the size and distribution of other mass components on the mother...

Страница 25: ...GE 845PE Chipset G MCH Thermal Design Guide 25 Figure 11 Intel G MCH Clip Frame and Lever Clip Lever Lever Handle CAM Profile Pivot Axle Clip Frame Clip_Frame 4 4 Intel G MCH Heatsink Drawings Contact...

Страница 26: ...Generic Thermal Attach Mechanical Solution R 26 Intel 845GE 845PE Chipset G MCH Thermal Design Guide This page is intentionally left blank...

Страница 27: ...000 065 Intel 82845 GMCH Clip Lever A67031 001 CCI 334C813402A Attach Hardware Solder Down Anchor A13494 005 Foxconn HB96030 DW Foxconn PHC029C02012 Enabling Assembly Intel 82845 GMCH Enabling Assembl...

Страница 28: ...Vendors R 28 Intel 845GE 845PE Chipset G MCH Thermal Design Guide This page is intentionally left blank...

Страница 29: ...FC BGA Package Dimensions Top and Side View Pkg760_Side Top Units Millimeters 1 08 0 06 Die 0 200 A Side View Substrate 0 500 0 070 See Detail D 37 50 0 050 Top View 37 50 0 05 17 9250 16 9500 Detail...

Страница 30: ...00 0 435 AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A 2 10 16 20 22 3 5 7 9 11 13 15 17 19 1 21 4 6 18 8 12 14 23 24 32 25 27 29 31 33 35 37 26 28 30 34 3...

Страница 31: ...Appendix A Package Dimensions R Intel 82845PE 82845GE GMCH Thermal Design Guide 31 Figure 14 Intel 82845GE GMCH 82845PE MCH Keep Out Restriction Keep Out_Restrict GMCH...

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