Everest XCR - Product Manual |
Installation
INGENIA | 08/04/2019
16
6. Installation
6.1. Unpacking
When unpacking the Everest XCR please ensure the following:
•
Remove the drive from the bag carefully.
•
Check that there is no visible physical damage. If any, report it immediately to the carrier.
• Check the part number of the drive on the side label.
Mounting the Everest to a Heatsink or Cooling Plate
for assembling the drive to a cooling plate or heatsink. The maximum
threaded length is 6.4 mm. Assembling the Everest correctly is essential to:
1. Provide a conduction heat dissipation path.
2. Ensure electrical conduction between the drive and Protective Earth, chassis or the motor enclosure. This is
strongly recommended for EMC.
3. Secure the drive in place to prevent any damage.
6.1.1. Back Installation
The preferred way to assemble the Everest XCR is from the back using a thermal interface tape (Suggested part
numbers are T-Global Technology LI98-1140-27-0.25, for best assembly strength and tolerant to minor surface
imperfections, LI98-1100-27-0.15 for high quality flat rectified surfaces or Berquist Bond-Ply 100 series) and 4 x M2.5
screws. Follow this steps:
1. Ensure the bottom surface of the Everest and the heatsink are clean and dry. Isopropyl alcohol (isopropanol)
applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust
or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components.
Allow the surface to dry for some minutes before applying the tape. More aggressive solvents (such as
acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease,
machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. Note:-
Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents.
2. Cut a 34 mm x 27 mm piece of the thermal tape.
3. Apply the tape to the Everest bottom at a modest angle with the use of a squeegee, rubber roller or finger
pressure to help reduce the potential for air entrapment under the tape during its application. The liner can
be removed after positioning the tape onto the first substrate.
4. Assemble the Everest to the heatsink ensuring alignment to the holes by applying compression to ensure a
good wetting of the substrate surfaces with the tape. Proper application of pressure ~ 5 kg and time (> 5 s) is
crucial for best thermal performance as the surface adhesive will have better wetting. A twisting motion
during assembly will improve wetting. This should be a back and forth twisting motion during the
application of compression. Moderate heat (<85ºC) can be employed to increase wetting percentage and
wetting rate of the substrates and to build room temperature bond strength.
5. Screw the 4 x M2.5 screws applying between 0.17 and 0.3 Nm of torque. Note that the M2.5 thread should be
handled gently. The threads may penetrate the thermal interface material if the corners have not been
trimmed.
Note, for highest heat dissipation performance (high current and voltage application) thermal grease or silicone
may also be used. However it complicates and makes a dirtier process.
