15.
If
you
are
replacing
the
system
board,
continue
with
step
16
using
the
new
system
board
with
the
existing
shuttle.
16.
Align
the
system
board
with
the
shuttle
and
replace
the
30
screws
that
were
removed
in
step
11
on
page
124
and
step
12
on
page
124
above.
Be
sure
to
replace
the
heat
sink
retention
modules
that
had
been
removed.
Attention:
Do
not
over-tighten
the
screws
that
secure
the
system
board
to
the
shuttle.
17.
Slide
the
replacement
shuttle,
with
its
attached
system
board,
in
from
the
rear
of
the
server
and
close
the
board
locking
latch.
18.
Replace
all
components
in
the
reverse
order
from
which
they
were
removed.
19.
Replace
the
top
cover
and
bezel
(see
“Installing
the
top
cover
and
bezel”
on
page
105).
Thermal
grease
This
section
contains
information
about
removing
and
replacing
the
thermal
grease
between
the
heat
sink
and
the
microprocessor.
The
thermal
grease
must
be
replaced
anytime
the
heat
sink
has
been
removed
from
the
top
of
the
microprocessor
and
is
going
to
be
reused,
or
when
debris
is
found
in
the
grease.
Note:
v
Read
“Before
you
begin”
on
page
39.
v
Read
the
safety
notices
at
“Safety
information”
on
page
167.
v
Read
“Handling
electrostatic
discharge-sensitive
devices”
on
page
170
Complete
the
following
steps
to
replace
damaged
or
contaminated
thermal
grease
on
the
microprocessor
and
heat
sink:
1.
Place
the
heat
sink
on
a
clean
work
surface.
2.
Remove
the
cleaning
pad
from
its
package
and
unfold
it
completely.
3.
Use
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
bottom
of
the
heat
sink.
Note:
Be
sure
that
all
of
the
thermal
grease
is
removed.
4.
Use
a
clean
area
of
the
cleaning
pad
to
wipe
the
thermal
grease
from
the
microprocessor;
then,
dispose
of
the
cleaning
pad
after
all
of
the
thermal
grease
is
removed.
Microprocessor
0.01 mL of
thermal grease
5.
Use
the
thermal
grease
syringe
to
place
16
uniformly
spaced
dots
of
0.01
mL
each
on
the
top
of
the
microprocessor.
Chapter
5.
Service
replaceable
units
125
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