Chapter
5.
Replacing
components
This
chapter
lists
replacement
parts
and
explains
the
procedures
for
replacing
a
controller,
a
power
supply
and
fan
unit,
an
interconnect-battery
unit,
and
an
SFP
module.
Before
using
the
procedures
in
this
chapter,
perform
the
appropriate
troubleshooting
steps
described
in
and
in
the
Recovery
Guru.
The
following
list
shows
the
components
that
you
can
replace
on
site.
To
order
parts,
contact
your
IBM
service
representative.
v
RAID
controllers
v
Power
supply-fans
(containing
power
supplies,
fans,
and
battery
chargers)
v
Interconnect-battery
unit
(containing
the
midplane
and
batteries
for
the
cache
backup)
v
SFP
modules
v
Interface
cables
v
Ethernet
cables
Attention:
Never
remove
the
interconnect-battery
unit
unless
directed
to
do
so
by
an
IBM
Service
representative.
Refer
to
for
complete
information
about
the
conditions
required
for
safe
removal
of
the
interconnect-battery
unit.
This
chapter
also
provides
instructions
to
help
you
add
new
DS4000
storage
expansion
enclosures
to
existing
DS4800
configuration.
You
can
perform
all
replacement
procedures
in
this
chapter
as
hot-swap
procedures.
Hot
swap
refers
to
the
ability
to
remove
and
replace
a
storage
subsystem
component
while
the
storage
subsystem
is
under
power
and
processing
data.
The
DS4800
Storage
Subsystem
has
three
major
components
you
can
replace
on
site:
the
controller,
power
supply
and
fan
unit,
and
interconnect-battery
unit.
In
a
fully
configured
storage
subsystem,
the
controllers
and
power
supply
and
fan
units
are
redundant.
If
any
one
of
these
redundant
components
fails,
the
component
can
be
replaced
without
powering
off
the
storage
subsystem,
and
without
interrupting
data
processing.
For
more
CRU
and
Option
part
number
information,
see
the
following
Web
site:
www.ibm.com/servers/storage/support/disk/
Handling
static-sensitive
devices
Attention:
Static
electricity
can
damage
electronic
devices
and
your
system.
To
avoid
damage,
keep
static-sensitive
devices
in
their
static-protective
packages
until
you
are
ready
to
install
them.
To
reduce
the
possibility
of
electrostatic
discharge,
observe
the
following
precautions:
v
Limit
your
movement.
Movement
can
cause
static
electricity
to
build
up
around
you.
v
Handle
the
device
carefully,
holding
it
by
its
edges
or
its
frame.
v
Do
not
touch
solder
joints,
pins,
or
exposed
printed
circuitry.
©
Copyright
IBM
Corp.
2006,
2007
141
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