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IBM Power 720 and 740 Technical Overview and Introduction
Small physical footprint
The performance of eDRAM when implemented on-chip is similar to conventional SRAM
but requires far less physical space. IBM on-chip eDRAM uses only one-third of the
components used in conventional SRAM, which has a minimum of six transistors to
implement a 1-bit memory cell.
Low energy consumption
The on-chip eDRAM uses only 20% of the standby power of SRAM.
2.1.6 processor and Intelligent Energy
Energy consumption is an important area of focus for the design of the processor,
which includes Intelligent Energy features that help to dynamically optimize energy usage and
performance so that the best possible balance is maintained. Intelligent Energy features, such
as EnergyScale, work with IBM Systems Director Active Energy Manager™ to dynamically
optimize processor speed based on thermal conditions and system utilization.
2.1.7 Comparison of the , POWER7, and POWER6 processors
Table 2-2 shows comparable characteristics between the generations of ,
POWER7, and POWER6 processors.
Table 2-2 Comparison of technology for the processor and the prior generations
Characteristics
POWER7
POWER6
Technology
32 nm
45 nm
65 nm
Die size
567 mm
2
567 mm
2
341 mm
2
Maximum cores
8
8
2
Maximum SMT
threads per core
4 threads
4 threads
2 threads
Maximum frequency
4.3 GHz
4.25 GHz
5.0 GHz
L2 Cache
256 KB per core
256 KB per core
4 MB per core
L3 Cache
10 MB of FLR-L3 cache
per core with each core
having access to the full
80 MB of L3 cache,
on-chip eDRAM
4 MB or 8 MB of FLR-L3
cache per core with
each core having
access to the full 32 MB
of L3 cache, on-chip
eDRAM
32 MB off-chip eDRAM
ASIC
Memory support
DDR3
DDR3
DDR2
I/O bus
Two GX++
Two GX++
One GX++
Enhanced cache
mode (TurboCore)
No
Yes
a
a. Only supported on the Power 795.
No
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