Chapter 2. Hardware architecture
35
The processor book contains the POWER5 processors, the L3 cache
modules located in Multichip modules, memory and RIO-2 attachment cards.
CEC backplane (double sided passive backplane) that serves as the system
component mounting unit. Processor books plug into the front side of the
backplane. The node distributed converter assemblies (DCA) plug into the
back side of the backplane. The DCAs are the power supplies for the
individual processor books.
A Fabric bus structure on the backplane board provides communication
between books.
Service processor unit.
Located in the panel above the distributed converter assemblies (DCA):
contains redundant service processors and Oscillator cards.
Remote I/O (RIO) adapters to support attached I/O drawers.
Fans and blowers for CEC cooling.
Light strip (front, rear).
The backplane is positioned vertically in the center of the CEC, and provides
mount spaces for processor books.This is a double sided passive backplane.
Figure 2-8 depicts component population on both the front side and back side of
the backplane.
The CEC backplane provides the following types of slots:
Slots for up to four processor books.
Processor Books plug into the front side of the backplane and are isolated
into their own power planes which allows the system to power on/off individual
nodes within the CEC.
Slots for up to 12 distributed converter assemblies DCA. Three DCAs per
processor book provide N+1 logic redundancy.The DCA trio is located on the
rear CEC, behind the processor book they support.
Fabric bus for communications between processor books.
Located in the panel above the CEC DCAs are
Service processor and OSC unit assembly
VPD card
Note: In the p5-590 configuration, book 2 and 3 are not required
Содержание p5 590
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