2 PinS anD PaCKaGeS
2-18
Seiko epson Corporation
S1C63003/004/008/016 TeChniCal Manual
(Rev. 1.1)
Diagram of pad layout
1.900 mm
Y
X
(0, 0)
1.890 mm
15
20
25
30
35
40
45
49
Die No.
1
5
10
4.1.2 S1C63003 pad layout diagram
Figure 2.
Chip thickness:
400 µm
Pad opening (X
×
Y): 77
×
85 µm (No. 1 to No. 13, No. 26 to No. 37)
85
×
77 µm (No. 14 to No. 25, No. 38 to No. 49)
Note: A chip thickness that exceeds 400 µm cannot be specified even if a chip other than the standard
thickness type is required.
Pad coordinates
4.1.1 S1C63003 pad coordinates
Table 2.
No.
Pad name
X (
µm
) Y (
µm
)
No.
Pad name
X (
µm
) Y (
µm
)
1 HUD
(SEG55)
-447.6 -859.0
26 COM2
560.1 859.0
2 SEN1
(SEG54)
-357.6 -859.0
27 COM1
470.1 859.0
3 REF1
(SEG53)
-267.6 -859.0
28 COM0
380.1 859.0
4 RFIN1
(SEG52)
-177.6 -859.0
29 CB
214.0 859.0
5 V
SS
-87.6 -859.0
30 CA
124.0 859.0
6 P53/RFIN0
(SEG51)
2.4 -859.0
31 V
C3
34.0 859.0
7 P52/REF0
(SEG50)
92.4 -859.0
32 V
C2
-56.0 859.0
8 P51/SEN0
(SEG49)
182.4 -859.0
33 V
C1
-146.0 859.0
9 P50/RFOUT
(SEG48)
272.4 -859.0
34 V
OSC
-236.0 859.0
10 P23
(SEG47)
362.4 -859.0
35 OSC1
-326.0 859.0
11 P22
(SEG46)
452.4 -859.0
36 OSC2
-416.0 859.0
12 P21
(SEG45)
542.4 -859.0
37 V
SS
-506.0 859.0
13 P20
(SEG44)
632.4 -859.0
38 V
D1
-854.0 171.5
14 SEG9
854.0 -272.8
39 V
DD
-854.0
81.5
15 SEG8
854.0 -182.8
40 TEST
-854.0
-8.5
16 SEG7
854.0
-92.8
41 RESET
-854.0
-98.5
17 SEG6
854.0
-2.8
42 P03/KRST03/KEY03
-854.0 -188.5
18 SEG5
854.0
87.2
43 P02/KRST02/KEY02
-854.0 -278.5
19 SEG4
854.0 177.2
44 P01/KRST01/KEY01
-854.0 -368.5
20 SEG3
854.0 267.2
45 P00/KRST00/KEY00
-854.0 -458.5
21 SEG2
854.0 357.2
46 P13/FOUT
-854.0 -548.5
22 SEG1
854.0 447.2
47 P12/BZ
-854.0 -638.5
23 SEG0
854.0 537.2
48 P11/TOUT_A
-854.0 -728.5
24 COM4
854.0 627.2
49 P10/EVIN_A
-854.0 -818.5
25 COM3
854.0 717.2