2 PinS anD PaCKaGeS
S1C63003/004/008/016 TeChniCal Manual
Seiko epson Corporation
2-13
(Rev. 1.1)
Diagram of pad layout
2.500 mm
Y
X
(0, 0)
2.195 mm
1
5
10
15
20
25
30
35
40
45
50
55
60
65
70
Die No.
3.1.3 S1C63004 pad layout diagram
Figure 2.
Chip thickness:
400 µm
Pad opening (X
×
Y): 77
×
85 µm (No. 1 to No. 18, No. 39 to No. 51)
85
×
77 µm (No. 19 to No. 38, No. 52 to No. 70)