2 PinS anD PaCKaGeS
2-2
Seiko epson Corporation
S1C63003/004/008/016 TeChniCal Manual
(Rev. 1.1)
Diagram of pad layout
Y
X
(0, 0)
2.655 mm
2.677 mm
1
5
10
15
20
25
30
35
40
45
50
55
60
65
70
75
80
85
90
91
Die No.
1.1.2 S1C63016 pad layout diagram
Figure 2.
Chip thickness:
400 µm
Pad opening (X
×
Y): 77
×
85 µm (No. 1 to No. 25, No. 51 to No. 72)
85
×
77 µm (No. 26 to No. 50, No. 73 to No. 91)
Note: A chip thickness that exceeds 400 µm cannot be specified even if a chip other than the standard
thickness type is required.