2 PinS anD PaCKaGeS
S1C63003/004/008/016 TeChniCal Manual
Seiko epson Corporation
2-7
(Rev. 1.1)
Diagram of pad layout
Y
X
(0, 0)
2.459 mm
2.501 mm
5
10
15
45
50
55
60
65
70
75
85
80
1
20
25
30
35
40
Die No.
2.1.2 S1C63008 pad layout diagram
Figure 2.
Chip thickness:
400 µm
Pad opening (X
×
Y): 77
×
85 µm (No. 1 to No. 19, No. 43 to No. 61)
85
×
77 µm (No. 20 to No. 42, No. 62 to No. 85)
Note: A chip thickness that exceeds 400 µm cannot be specified even if a chip other than the standard
thickness type is required.