epm CIG 300 compact TMS, Руководство по эксплуатации

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epm
Structure and Function
September 2007 Edition
Operating Manual CIG compact TMS DuplexAutomatic Soldering Machine Page 3-1
3 Structure and Function
Table of Contents Chapter 3
Page
3.1 System Description ......................................................................................................3-3
3.2 Transport System .........................................................................................................3-5
3.2.1 Inlet and Outlet Extension (Option).......................................................3-5
3.2.2 Board, Mask, PCB Separation (Option)................................................3-5
3.2.3 Carrier Transport...................................................................................3-5
3.2.3.1 Soldering Carrier...................................................................................3-6
3.2.4 Transport Modules (Option)..................................................................3-6
3.2.4.1 Transport Modules for Automatic Soldering Machine with Carrier
Transport (Option).................................................................................3-6
3.3 Flux System...................................................................................................................3-7
3.3.1 Atomizer Fluxer.....................................................................................3-8
3.3.1.1 Fluxer Pump..........................................................................................3-9
3.3.1.2 Flow Meter ..........................................................................................3-10
3.3.1.3 Flow Monitoring...................................................................................3-10
3.3.1.4 Level Monitoring..................................................................................3-11
3.4 Drying and Preheating System .................................................................................3-12
3.4.1 IR-Preheater .......................................................................................3-12
3.4.1.1 Underside Preheater...........................................................................3-12
3.4.2 Temperature Regulation (Option).......................................................3-12
3.4.3 Convection Preheating (Option) .........................................................3-12
3.5 Soldering System .......................................................................................................3-13
3.5.1 Solder Bath .........................................................................................3-13
3.5.2 Wave Former ......................................................................................3-14
3.5.2.1 Hollow Wave (First Wave) ..................................................................3-14
3.5.2.2 Full Wave (Second Wave) ..................................................................3-15
3.5.3 Solder Pumps .....................................................................................3-15
3.5.4 Heating System...................................................................................3-16
3.5.4.1 Main System .......................................................................................3-16
3.5.4.2 Auxiliary System .................................................................................3-16
3.6 Inert Gas System ........................................................................................................3-17
3.6.1 Inert Gas Atmosphere.........................................................................3-17
3.6.2 Residual Oxygen Measurement .........................................................3-17
3.6.3 Gas Consumption ...............................................................................3-17
3.6.4 Condensate Trap (Option)..................................................................3-18
3.7 Controller System.......................................................................................................3-19
3.7.1 Central Control Unit ............................................................................3-19
3.7.2 Machine Coding..................................................................................3-20
3.7.2.1 No Coding ...........................................................................................3-20
3.7.2.2 Binary Coding (Option) .......................................................................3-20
3.7.2.3 Barcoding (Option)..............................................................................3-20
3.7.3 PC Controller with MIS Management Information System .................3-21
3.7.3.1 Printer..................................................................................................3-21
3.7.3.2 Maintenance Software "UPTIME" (Optional)......................................3-21