epm CIG 300 compact TMS, Руководство по эксплуатации

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epm
Maintenance, Service
December 2004 Edition
Operating Manual CIG compact TMS Duplex Automatic Soldering Machine Page 8-23
8.8.1.5 Cleaning the Solder Bath
Place the chain guard plates on the trans-
port rails.
Remove the slag collection plate. This plate
is inserted in front of the pumps. (View from
operator side).
The fixed chip wave, together with the
quick-acting closure, can be dismantled and
cleaned as an entire unit. If required, re-
place the special O-ring seal at the base of
the wave. It must be ensured that only origi-
nal seals are used.
Wear protective clothing
Clean the wave former and bath walls (to
the extent accessible from the top).
8.8.1.6 Wörthmann Wave (option)
Set the soldering angle to 6 to 7°. After
mounting the insert and a 10-minute heat-
ing-up phase, the front edge of the solder
wave is set at about 5.5 mm (optional: 7.5
mm). The symmetric setting can be checked
with a temperature-resistant glass plate.
The solder must run off away from the direction of transport. The discharge capacity of the
pump must be set to the maximum and the speed to about 0.8/m/min.
Decisive for the discharge behavior of the solder wave: Essentially, through fine adjust-
ment of the through-flow height in the range from +/- 0.3 mm, a minimum of solder bridging
can be achieved.
Maintenance: The holes of the solder wave bar should be pierced with a pipe cleaner or
the cleaning punch (optional).