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SB300 FOSB FOR 300 MM WAFERS
User Manual | Entegris, Inc.
SEMI E106
Provisional Overview Guide for Physical Interfaces
and Carriers for 300 mm Wafers
SEMI E106 describes the complex interdependen-
cies among SEMI standards for 300 mm physical
interfaces and carriers, and explains how standards
apply to specific products.
SEMI E47.1
Provisional Mechanical Specification for Boxes and
Pods used to Transport and Store 300 mm Wafers
SEMI E47.1 is a standard that applies to various types
of 300 mm pods. The outside shape and overall pod
size are limited by this standard. Equipment automa-
tion and human interface features are also defined by
the standard.
SEMI E57
Provisional Mechanical Specification for Kinematic
Couplings used to Align and Support 300 mm
Wafer Carriers
SEMI E57 describes the equipment side of the
kinematic coupling that is the universal equipment
interface for all types of 300 mm wafer carriers.
This standard describes very specifically the shape and
position of three pins. The 300 mm carrier must have
features, which register with these pins, but the shape
of these features is up to the carrier maker to design.
The test of a wafer carrier’s compliance to E57 can
only be made by placing that carrier on a fixture that
is compliant to SEMI E57 and measuring the locations
of features relative to the resulting datum structure.
SPECIFICATIONS
—
• Wafer size: 300 mm (11.81") diameter
• Wafer capacity: 25
• Wafer spacing: 10 mm (0.40")
• Wafer carrier type: FOSB
• Overall dimensions
— Height from horizontal datum plane (including
auto-top flange): 336.93 mm (13.265")
— Width: 385.17 mm (15.164")
— Width with handles: 415.369 mm (16.369")
— Depth: 332.77 mm (13.101")
330.1 mm
(13.0")
336.8 mm
(13.26")
39.3 mm
(1.55")
25.5 mm
(1.00")
415.8 mm (16.37")
385.2 mm (15.16")
363.7 mm (14.32")
258.0 mm (10.16")
165.2 mm
(6.5")
Facial
332.8 mm (13.1")
Figure 11. SB300 FOSB dimensions
