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SB300 FOSB FOR 300 MM WAFERS
User Manual | Entegris, Inc.
DATUM ORIENTATION
—
HORIZONTAL DATUM
The horizontal datum is located near the bottom of
the carrier (Figure 6). Frame location for the purpose
of automated transfer in and out of the cassette is
defined in the Z direction relative to this datum.
FACIAL DATUM
The facial datum is a vertical plane centered on
the film frame and oriented left to right. It is used
as a reference for front to back Y dimensions.
BILATERAL DATUM
The bilateral datum is a vertical plane centered on
the wafers and oriented front to back. It is used as
a reference for left to right X dimensions.
X, Y, AND Z DIMENSIONS
X dimensions are horizontal left to right. Y dimensions
are horizontal front to back. Z dimensions are vertical.
STRUCTURE
Datum Orientation Relative to the First Wafer
All 300 mm wafers, when fully seated in the shipper,
are nominally centered on the vertical line formed by
the intersection of the bilateral datum and the facial
datum (Figure 7). The botom of the first wafer, located
in the lowest pocket of the FOSB, is located nominally
at 44 mm above the horizontal datum.
Wafer Spacing
Each wafer above the first wafer is located nominally
at 10 mm spacing. The tolerance for vertical wafer
location is ±0.5 mm for each wafer (Figure 8). The
tolerance is non-accumulative.
Figure 6. Datum orientation
Front to back
+Y
–Y
–X
+X
Left to right
Up +Z
Horizontal datum
Bilateral
datum
Facial
datum
Figure 7. Datum structure
Front to back
+Y
–Y
–X
+X
Left to right
Up +Z
Horizontal datum
Bilateral
datum
Facial
datum
+ 0.5 mm
- 0.5 mm
Bilateral
datum
Facial
datum
Figure 8. Wafer spacing and tolerance
