Dell EMC PowerEdge R940xa, Инструкция по установке и обслуживанию, Страница: 164 / 177

Thermal and acoustics
The system's thermal management delivers high performance through optimized cooling of components at the lowest fan speeds across a
wide range of ambient temperatures from 10°C to 35°C (50°F to 95°F) and to extended ambient temperature ranges. These
optimizations result in lower fan power consumption which translate to lower system power and data center power consumption.
Thermal design
The thermal design of the system reflects the following:
• Optimized thermal design: The system layout is architected for optimum thermal design. System component placement and layout are
designed to provide maximum airflow coverage to critical components with minimal expense of fan power.
• Comprehensive thermal management: The thermal control system regulates the system fan speeds based on feedback from system
component temperature sensors, as well as for system inventory and subsystem power draw. Temperature monitoring includes
components such as processors, DIMMs, chipset, system inlet air ambient, hard disk drives, NDC, and GPU.
• Open and closed loop fan speed control: Open loop fan control uses system configuration to determine fan speed based on system
inlet air temperature. Closed loop thermal control uses temperature feedback to dynamically adjust fan speeds based on system
activity and cooling requirements.
• User-configurable settings: With the understanding and realization that every customer has a unique set of circumstances or
expectations from the system, in this generation of servers, we have introduced limited user-configurable settings in the iDRAC9 BIOS
setup screen. For more information, see the Dell EMC PowerEdge system Installation and Service Manual on Dell.com/Support/
Manuals and “Advanced Thermal Control: Optimizing across Environments and Power Goals” on Dell.com.
• Cooling redundancy: The system allows N+1 fan redundancy, allowing continuous operation with one fan failure in the system.
• Environmental Specifications: The optimized thermal management makes the R940xa reliable under a wide range of operating
environments.
Expanded operating temperature restrictions
• The operating temperature is for a maximum altitude of 950 m for fresh air cooling
• No cold start-ups below 5°C due to hard drive constraints
• Apache Pass DIMM, NVDIMM, PCIeSSD and NVME are not supported
• GPGPU configuration are not supported
• LRDIMM > 32 GB are not supported in x4 socket configurations
• DCPMMs are not supported.
• Redundant power supply units are required
• Non Dell qualified peripheral cards and /or peripheral cards greater than 25 W are not supported
• Intel FPGA is not supported
• Mellanox CX5 is not supported
Fresh air restrictions
Following table lists the configuration required for efficient cooling.
Table 40. Fresh air restriction matrix
Processors
Number of
Processor/
GPUs
Number of
drives
Ambient
temperatur
e
Fresh air
support
Fan type
Processors
Shroud
Up to 304W
processor
(CPU 1/2)
Up to 304W
processor
(CPU 3/4)
All GPU/2&4
CPU 32x2.5-inch,
w/ NVMe 30 No AEP Six standard
2U height
HSK
4U height
HSK
Remove the
air shroud A
(L-shape)
All No
GPU /2&4
CPU 32x2.5-inch,
w/ NVMe 35 No AEP Six standard
2U height
HSK
4U height
HSK
Install the air
shroud A
(L-shape)
205W /
200W /
165W_12C / No GPU /4
CPU 32x2.5-inch,
w/o NVMe 35 No AEP Six standard
2U height
HSK
4U height
HSK
Install the air
shroud A
(L-shape)
164 Technical specifications