![background image](http://html1.mh-extra.com/html/xilinx/kria-k26-som/kria-k26-som_design-manual_3372861040.webp)
Note: PCB fab and assembly contractors must be able to produce carrier cards to the specifications listed
in the
PCB Fabrication and Assembly House Requirements
section. In addition, the connectors that are
shifted by 15% of the pad width must be capable of self-aligning after a reflow soldering process.
SOM to Carrier Card Samtec Connector
Placement Guidelines
Both the commercial (C) grade and industrial (I) grade SOMs have two Samtec 0.635 mm
AcceleRate
®
HD high-density, 4-row, 60-position connectors. The Samtec part number is ADF6–
60–03.5–L–4–2–A. The connectors are placed on the bottom side of the carrier card centered
between the mounting holes shown in
.
Board-to-board (B2B) mating connectors must be precisely placed on the PCB, particularly for
multi-pair connector applications. Tight control is required during the board layout design and
the manufacturing process for product reliability and a decent yield rate. To avoid over-stressing
the mechanical design of the connectors and creating functional damage during system assembly,
the next figure includes the recommended maximum position tolerance of the connector. Auto-
placement machine accuracy and the tolerance of the connector pin solder pad position
contributes to this recommendation.
Chapter 3: Mechanical Design Considerations
UG1091 (v1.0) April 20, 2021
Carrier Card Design for Kria SOM
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