Thales Cinterion MV31-W, Hardware Interface Description

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Cinterion ® MV31-W Hardware Interface Description
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MV31-W_HID_v01.009a 2022-04-27
Public / Preliminary
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Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 01.009
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 01.009a
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058c
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 01.009
Preceding document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058b
New document: Cinterion
®
MV31-W Hardware Interface Description, Version 00.058c
Chapter What is new
2.3 Revised Figure 7 showing H2.3-S5 dimensions.
3.1 Updated electrical characteristics for FULL_CARD_POWER_OFF# ( Table 3 ).
3.2.7 Updated Figure 13 to include second PCIe interface lane.
3.2.8.1 Revised Figure 15 to update enhanced ESD protection for SIM interface
3.2.9 New Section eUICC Interface .
4.1 Added notes regarding usage of antenna interfaces.
5.3 Revised thermal design guidelines.
Chapter What is new
2.1 Revised supported 5G bands with DSS.
Revised SIM feature description (DSSS -> DSSA).
2.3 Added 2.3 bottom shield dimensions.
5.2 Added thermal resistance value to Table 17 .
5.9 Updated complete approval section.
6 New Appendix with label, packaging and conformance information.
Chapter What is new
2.1 Revised PCIe features.
Revised 5G/4G category features.
2.2 Revised Figure 3 to add optional UIM card holder.
3.1 Updated some electrical descriptions in Table 3 .
3.2.2.3 Added note recommending >30s pause between powering off and on again.
4.1 Revised Table 13 , Table 14 , and Table 15 .
5.4 Added remark regarding recommended power reserve for peak current consumption.
6 Removed Appendix with tables showing supported CA and EN-DC configurations.
These configurations are now listed in a dedicated User Guide (see [2] ).