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MV31-W Hardware Interface Description
5.3 Thermal Design Guidelines
75
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MV31-W_HID_v01.009a
2022-04-27
Public / Preliminary
Page 45 of 76
5.3
Thermal Design Guidelines
The MV31-W m.2 card temperature rises because electrical energy is turned into heat. De-
pending on the application itself and housing different methods are recommend to allow the
card operate under ideal conditions. The actual temperature of the board depends on different
factors such as the radio technology e.g. 4G or 5G, but also on the used frequency bands with
Sub6, and the output power.
The MV31-W has an optimized mechanical temperature design with a stepped EMI shielding
which allows up to 19°C higher ambient temperature.
shows the 3 level throttling mechanism based on pre-defined temperature values (
), which is used by MV31-W.
The stepped EMI shielding improves the time up to 42% before the MV31-W throttling levels
are starting.
illustrates a few recommended solutions that are mandatory for a full perfor-
mance 5G operation of the MV31-W and the application.
Table 18:
3 Level Throttling Mechanism
Thermal
Level
LTE Throttling
(SKIN Sensor)
LTE Throttling
(PA Sensor)
5G Sub6G Throttling
(SKIN Sensor)
5G Sub6G Throttling
(PA Sensor)
Level 1
4 Rx to 2 RXx fallback
Drop SCells with vRLF
UL throttling
Drop SCells with vRLF
Drop PSCell/disable NR in NSA
UL throttling
Level 2
N/A
Tx power back off
(MTPL)
N/A
Tx power back off
(MTPL)
Drop PSCell/Disable NR in NSA
Level 3
Limited Service
