Cinterion
®
MV31-W Hardware Interface Description
5.3 Thermal Design Guidelines
75
t
MV31-W_HID_v01.009a
2022-04-27
Public / Preliminary
Page 48 of 76
Figure 24:
Option 5 - Heat pipe and big application housing
Figure 25:
Thermal distribution with a heat pipe
Cop per/Aluminium
Application/ System PCB
(typ. 1.6mm)
M.2 PCB
(0.8mm)
Heat pipe
M.2 CON
H2.3 S5
(Typ 2.25mm)
TIM
(typ. 0.3mm)
RF PCB
IC
IC
IC
Housing
0.8mm M.2 PCB
+1.3mm Shield
+0.5mm Shield
2.
6m
m
to
ta
l
he
ig
ht
Screw
CON
Recommended to use GND
planes stiched with vias for
better thermal performance
Heat pipe
IC
Shield
Heat spot of th e M.2 card is below
the lower shield. Allows internally
thinner TIM with lo wer Rth