Cinterion
®
MV31-W Hardware Interface Description
3.2 Characteristics
75
t
MV31-W_HID_v01.009a
2022-04-27
Public / Preliminary
Page 34 of 76
To avoid possible cross-talk from the UIM_1_CLK signal to the UIM_1_DATA signal, be careful
that both lines are not placed closely next to each other. A useful approach is using a GND line
to shield the UIM_1_DATA line from the UIM_1_CLK line.
3.2.8.1
ESD Protection for SIM Interfaces
For ESD protection of the SIM interfaces it is required to add ESD diodes to the interface lines
of the first and second SIM interface as shown in the example given in
The example was designed to meet ESD protection according ETSI EN 301 489-1/7: Contact
discharge: ± 4kV, air discharge: ± 8kV.
Figure 15:
SIM interfaces - enhanced ESD protection
3.2.9
eUICC Interface
A dedicated 5G M.2 Data Card MV31-W hardware variant supports an eUICC in MFF-XS for-
mat. This MFF-XS eUICC is located under the shielding, and is internally connected to the spe-
cific module pads that are alternatively available as an optional second SIM interface. It has no
physical connections with other circuits inside the module. To be continued...
3.2.10
GPIO Interface
The GPIO is reserved for future use.
1
2
3
6
5
4
SIM_RST
M
.2
Da
ta
Ca
rd
GND
5-line transient voltage
Suppressor array, e.g.,
NUP4114 or ESDALCL6-4P6A
series
UIM_1_RESET
UIM_1_CLK
UIM_1_DATA
SIM_DETECT_1
UIM_1_PWR
SIM_VCC
SIM_IO
SIM_CLK
SIM_DET
SIM_GND
220nF
1nF
