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EXAMPLE STENCIL DESIGN
38 X (1.5)
38 X (0.3)
38 X (0.5)
(5.8)
(R0.05) TYP
TSSOP - 1.2 mm max height
DBT0038A
SMALL OUTLINE PACKAGE
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE: 10X
SYMM
SYMM
1
19
20
38
4220221/A 05/2020