Tektronix TLA7AA1, Manual, Page: 104 / 173

Adjustment Procedures
TLA7AXX Logic Analyzer Module Service Manual
5- 3
You must perform all adjustment procedures following replacement of any
circuit board in the logic analyzer module.
This section describes how to perform adjustments using the software.
Tests Performed
Table 5--1 lists the adjustment procedures available for the logic analyzer module
and for the related probes.
Table 5- 1: Logic analyzer adjustment procedures
Category Procedure
Self calibration Self Calibration
Probe+PIC Procedures Probe Gain and Offset
MIC Procedures Input Resistance
Digital Gain and Offset
Analog Gain and Offset
Probe+Module Timing Procedures Deskew
Merged Deskew Procedures Merged Deskew
With the exception of the self calibration procedures, all other procedures must
be completed using the performance verification software and the TLACAL2 test
fixture.
The Probe+PIC Procedure is an optional procedure used to calibrate the probe
gain and offset settings; you should not normally need to perform this procedure.
The probes are calibrated at the factory. However the procedure is provided so
that you can do a full calibration of your logic analyzer and probes if needed.
The Merged Deskew procedures are recommended for merged module configura-
tions.
Figure 5--1 shows the locations of connectors and test points on the TLACAL2
Performance Verification test fixture. You may need to refer to this illustration
when connecting probes and cables to the fixture.
Adjustment After Repair