IMSRM02-E6
i-3
CONTENTS
Page
1. OUTLINE ...............................................................................1
1.1 Handling Procedures.......................................................................................1
1.2 Confirmation of the Products...........................................................................2
1.3 Confirmation of the Model Code......................................................................3
2. SYSTEM CONFIGURATION...............................................12
2.1 Basic Configuration .......................................................................................12
2.2 Precautions for System Configuration ...........................................................13
3. DESCRIPTION OF EACH MODULES ................................19
3.1 Basic Configuration .......................................................................................19
3.2 Common Items of Each Module ....................................................................20
3.3 PCP Module ..................................................................................................25
3.4 TIO Module....................................................................................................33
3.5 CT Module.....................................................................................................42
3.6 DI Module ......................................................................................................44
3.7 DO Module ....................................................................................................46
4. MOUNTING .........................................................................51
4.1 Mounting Environment ..................................................................................51
4.2 Mounting Position within Panel......................................................................52
4.3 Dimensions....................................................................................................54
4.4 Mounting the Mother Block............................................................................56
4.5 Mounting the Module Mainframe...................................................................58
4.6 Removing the Module Mainframe..................................................................59
4.7 Terminal Covers ............................................................................................59
5. WIRING ...............................................................................60
5.1 Wiring Precautions ........................................................................................60
5.2 Wiring of Each Modules ................................................................................62
