(a)
3.9.2
Three Common BGA Landscapes
This RDK provides three common pitch BGA
landscapes in the prototyping area. BGA1 is a
full matrix of 20x20 @ 1.5mm pitch with the
plated hole size of 0.022” dia. +/-0.001”. The
BGA landscape labeled BGA2 is a full matrix of
26x26 @ 0.05” pitch with the same size of plated
hole as BGA1. The BGA landscape labeled
BGA3 is a full matrix of 25x25 @1.0mm pitch
holes with the plated hole size of 0.0165” dia. +/-
0.001”.
1. Buy both the Minigrid Socket and BGA
Land Socket from Ironwood Electronics.
2. Solder the Minigrid Socket to the PC
board.
3. Solder the BGA device to the Land
Socket and plug the Land Socket to the
Minigrid Socket.
(b)
1. Buy only BGA Land Sockets from
Ironwood Electronics.
We suggest using Ironwood Electronics (web
site:
) BGA Land
Sockets and/or Minigrid Sockets to convert from
BGA to PGA and prototype a BGA chip on this
RDK.
2. Solder the BGA device on the top of the
Land Socket and solder the Land
Socket to the PC board.
If a designer uses the BGA3 landscape, they
have only one choice, to buy Ironwood’s BGA
Land Socket. Solder the BGA on the top of the
Land Socket and solder the Land Socket to the
PC board.
Referring to Figure 3-2, if designers use either
the BGA1 or BGA2 landscape, they can choose
either a) or b) below:
Note: The size of each hole on BGA3 is
0.0165” in diameter. It only fits with the Land
Socket because the pin of Land Socket is
0.014” in diameter. Do not force the pin in the
hole. It should fit snugly.
BGA Device
Ironwood BGA
Land Socket
Ironwood Minigrid
Socket (Optional)
Target PCB
Solder
Plug
Solder
0.014"
0.018"
Figure 3-2. BGA Landscapes
PCI 9054RDK- LITE Hardware Reference Manual v1.3
12
© 2006 PLX Technology, Inc. All rights reserved.
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