Operations Manual: HPAC-100/125/150/200/250-RM SSPA
3-11
3 Operation of Stand-Alone Unit
The HPA will not transmit any information over the bus unless queried to do so from the
M&C system. The unit requires no handshaking on the interface, employing only Data
In, Data Out, and Ground signals. The serial communication utilizes 8 data bits, 1 stop
bit, and no parity.
System Configuration
The system configuration is set using three banks of DIP switches located on the I/O
card, one bank of DIP switches located on the processor card, and a connector which
plugs into the processor card. Access to both cards is obtained by removing the
bottom panel of the chassis. The processor card is plugged into the I/O card. The
location of the DIP switches can be seen in Figure 3-4. Specific descriptions of the
DIP switches are in the following sections.
Figure 3-4: HPA I/O card with attached microprocessor card.
DIP Switches
The three banks of DIP switches located on the lower portion of the I/O board and one
bank of DIP switches located on the processor board are used for setting the system
configuration. Figure 3-5 shows an expanded picture of the DIP switches. Their posi-
tion can be
OFF or ON. Table 3-6 lists the switches and their functions. Some of the
switches are user configurable while others are reserved for factory use only.
O
F F
I/O C ard
D IP S w itc he s
P ro c esso r C ard
O
F
F
Summary of Contents for HPAC-100-RM
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