4-2
Operations Manual: HPAC-100/125/150/200/250-RM SSPA
4 Theory of Operation
Figure 4-2: 2 RF module block diagram.
Figure 4-3: 3 RF module block diagram.
As seen in the figure 4-1, the I/O card with the processor has control of all aspects of
the unit. All information traveling between the on board components and the user must
pass through the processor which permits the processor to have total control.
The amplifier modules, attenuator, power monitor diode, and couplers comprise the
RF components. Depending upon the amplifier configuration, the number of these
components can differ.
Fault Analysis
The fault analysis in the HPAC is extensive. Figures 4-4 and 4-5 illustrate the moni-
tored faults for the 2 RF module and 3 RF module unit, respectively.
OPTIONAL REFLECTED
POWER MONITOR -
TO CONTROLLER CCA
RF PWR - TO CONTROLLER CCA
PREAMPLIFIER MODULE
TEST OUTPUT
RF IN
TEST INPUT
POST AMPLIFIER MODULE
PREAMPLIFIER MODULE
RF PWR - TO CONTROLLER CCA
RF IN
TEST INPUT
TEST OUTPUT
OPTIONAL REFLECTED
POWER MONITOR -
TO CONTROLLER CCA
POST AMPLIFIER MODULE
Summary of Contents for HPAC-100-RM
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