NXP Semiconductors i.MX RT500, Hardware Design Manual

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NXP Semiconductors
IMXRT500HDG
i.MX RT500 Hardware Design Guide
Operating characteristics:
• Power supply:
–
VDDCORE: 0.6 V to 1.155 V
– VDDIO_0/1/2/4: 1.71 V to 1.89 V
– VDDIO_3: 1.71 V to 3.6 V
• Temperature range (ambient): -20 C° to +70 C°
2 Acronyms and abbreviations
Table 1 defines the acronyms and abbreviations used in this document.
Acronym Definition
BGA Ball Grid Array
CLKIN Clock-In
CMOS Complementary Metal-Oxide-Semiconductor
FOWLP Fan-Out Wafer-Level Package
GPIO General-Purpose Input/Output
HDI High Density Interconnect
ISP In-System Programming
ITM Instrumentation Trace Macrocell
LDO Low-Dropout Regulator
MCU Microcontroller Unit
MLCCs Multi-layer Ceramic Capacitors
OTP One-Time-Programmable
PCB Printed-Circuit board
PFM Pulse-Frequency Mode
PMIC Power Management IC
PWM Pulse Width Modulation
PIU Port Interface Unit
QFN Quad Flat-pack No Lead
QSPI Quad Serial Peripheral Interface
RTC Real-Time Clocks
SDIO Secure Digital I/O
SWD Serial Wire Debug
SWO Serial Wire Output
SWC Serial Wire Clock
WLCSP Wafer-Level Chip-Scale Package
WLCSP Wafer-Level Chip-Scale Package
XTAL Crystal
Table 1. Acronyms and abbreviations
IMXRT500HDG All information provided in this document is subject to legal disclaimers. © 2022 NXP B.V. All rights reserved.
User guide Rev. 0 — 15 November 2022
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