APPENDIX A DEVELOPMENT TOOLS
User's Manual U11919EJ3V0UM00
202
Figure A-3. EV-9200G-44 Recommended Footprint (Reference)
0.031
×
0.394=0.315
0.031
×
0.394=0.315
A
F
D
E
B
G
H
I
J
C
L
K
EV-9200G-44-P1E
ITEM
MILLIMETERS
INCHES
A
B
C
D
E
F
G
H
I
J
K
L
15.7
11.0
11.0
15.7
5.00±0.08
5.00±0.08
0.5±0.02
1.57±0.03
2.2±0.1
1.57±0.03
0.618
0.433
0.433
0.618
0.197
0.197
0.02
0.062
0.087
0.062
0.8±0.02
×
10=8.0±0.05
0.8±0.02
×
10=8.0±0.05
φ
φ
φ
+0.002
–0.001
+0.002
–0.002
+0.002
–0.001
+0.002
–0.002
+0.003
–0.004
+0.003
–0.004
+0.001
–0.002
φ
φ
φ
+0.001
–0.002
+0.004
–0.005
+0.001
–0.002
Dimensions of mount pad for EV-9200 and that for target
device (QFP) may be different in some parts. For the
recommended mount pad dimensions for QFP, refer to
"SEMICONDUCTOR DEVICE MOUNTING
TECHNOLOGY MANUAL" (C10535E).
Caution
Based on EV-9200G-44
(2) Pad drawing (in mm)
Summary of Contents for mPD789026 Subseries
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