LTC3115-1
39
Rev. C
4.00 ±0.10
(2 SIDES)
5.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJGD-2) IN JEDEC
PACKAGE OUTLINE MO-229
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ±0.10
BOTTOM VIEW—EXPOSED PAD
2.44 ±0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
4.34 ±0.10
(2 SIDES)
1
8
16
9
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DHD16) DFN REV A 1113
0.25 ±0.05
PIN 1
NOTCH
0.50 BSC
4.34 ±0.05
(2 SIDES)
RECOMMENDED
SOLDER PAD PITCH AND DIMENSIONS
2.44 ±0.05
(2 SIDES)
3.10 ±0.05
0.50 BSC
0.70 ±0.05
4.50 ±0.05
PACKAGE
OUTLINE
0.25 ±0.05
DHD Package
16-Lead Plastic DFN (5mm
×
4mm)
(Reference LTC DWG # 05-08-1707 Rev A)
PACKAGE DESCRIPTION
