6
Thermal/Mechanical Design Guide
Tables
1-1 Reference Documents ...............................................................................................10
1-2 Terms and Descriptions .............................................................................................10
4-1 Socket Component Mass............................................................................................27
4-2 1366-land Package and LGA1366 Socket Stackup Height ...............................................27
4-3 Socket and ILM Mechanical Specifications ....................................................................28
4-4 Electrical Requirements for LGA1366 Socket ................................................................29
5-1 Boundary Conditions and Performance Targets .............................................................31
5-2 Performance Expectations for 25.5 mm Tall Heatsink.....................................................33
5-3 Fan Speed Control, TCONTROL and DTS Relationship ....................................................39
5-4 T
CONTROL
Guidance ...................................................................................................39
6-1 Heatsink Test Conditions and Qualification Criteria ........................................................43
A-1 Suppliers for the Intel Reference Thermal Solution ........................................................47
A-2 Suppliers for the Intel Collaboration Thermal Solution ...................................................48
A-3 Suppliers for the Alternative Thermal Solution ..............................................................48
A-4 LGA1366 Socket and ILM Components ........................................................................49
B-1 Mechanical Drawing List ............................................................................................51
C-1 Mechanical Drawing List ............................................................................................79
E-1 Boundary Conditions and Performance Targets .............................................................87
E-2 Embedded Heatsink Component Suppliers ...................................................................92
E-3 Mechanical Drawings List ...........................................................................................92
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
