Intel Xeon 5500 Series, Design Manual

Page: 53 / 98

Thermal/Mechanical Design Guide 53
Mechanical Drawings
Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4)
1
3
4
5
6
7
8
B C D
A
1
2
3
4
5
6
7
8
B C D A
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
R
2X 0.00
0.000 [ ]
2X
0.00
0.000[]
2X 7.50
0.295 [ ]
9.60
0.378 [ ]
12.30
0.484 [ ]
67.70
2.665 [ ]
2X 72.50
2.854 [ ]
32.85
1.293 [ ]
47.15
1.856 [ ]
BALL 1 4
19.17
0.755 [ ]
3.30
0.130
[] 29.90
1.177
[]
BALL 1
4
62.39
2.456
[] 77.90
3.067
[] 30.600
1.205
[] 49.40
1.945
[]
4X
NPTH
THERMAL RETENTION MOUNTING HOLES
4.03
+0.06 -0.03
0.159
+0.002 -0.001
[]
4X
NPTH
SOCKET ILM MOUNTING HOLES
3.80
+0.06 -0.03
0.150
+0.002 -0.001
[]
4X
NO ROUTE
COPPER PAD ON SURFACE
6.00
0.236
[]
4X
6.00
0.236
[]
2X
9.400
0.3701
[] 9.900
0.3898
[]
2X
70.600
2.7795
[]
22.000
0.8661 [ ]
58.000
2.2835 [ ]
2X
7.50
0.295
[]
2X
72.50
2.854
[]
85.00
3.346 [ ]
5.00
0.197 [ ]
5.00
0.197
[] 85.00
3.346
[]
2X 80.00
3.150 [ ]
3X
80.00
3.150
[]
D77712
2
0
2
DWG. NO
SHT.
REV
THIS DRAWING CONTAINS INTEL CORPORAT
ION CONFIDENTIAL INFORMATION. IT IS
DISCLOSED IN CONFIDENCE AND ITS CONT
ENTS
MAY NOT BE DISCLOSED, REPRODUCED, DI
SPLAYED OR MODIFIED, WITHOUT THE PRI
OR WRITTEN CONSENT OF INTEL CORPORAT
ION.
SHEET
2
OF
4
DO NOT SCALE DRAWING
SCALE:
3.000
EASD / PTMI
02
D77712
D
REV
DRAWING NUMBER
SIZE
DEPARTMENT
AS VIEWED FROM PRIMARY SIDE
OF THE MOTHERBOARD
(DETAILS)
SEE DETAIL
A
DETAIL
A
SCALE
6.000
LEGEND, THIS SHEET ONLY
ZONE 1: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE ZONE 2: 7.0 MM MAX COMPONENT HEIGHT
7
ZONE 3: 3.0 MM MAX COMPONENT HEIGHT
7
ZONE 4: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT RETENTION MODULE OR HEAT SINK TOUCH ZONE ZONE 5: 0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT, NO ROUTE ZONE ZONE 6: 1.97 MM MAX COMPONENT HEIGHT, SOCKET CAVITY
7