4
Thermal/Mechanical Design Guide
6
Quality and Reliability Requirements
.......................................................................43
6.1
Test Conditions .................................................................................................43
6.2
Intel Reference Component Validation ..................................................................45
6.2.1
Board Functional Test Sequence ...............................................................45
6.2.2
Post-Test Pass Criteria.............................................................................45
6.2.3
Recommended BIOS/Processor/Memory Test Procedures .............................46
6.3
Material and Recycling Requirements....................................................................46
A
Component Suppliers
...............................................................................................47
A.1
Intel Enabled Supplier Information .......................................................................47
A.1.1
Intel Reference Thermal Solution ..............................................................47
A.1.2
Intel Collaboration Thermal Solution..........................................................47
A.1.3
Alternative Thermal Solution ....................................................................48
A.1.4
Socket and ILM Components ....................................................................49
B
Mechanical Drawings
...............................................................................................51
C
Socket Mechanical Drawings
....................................................................................79
D
Heatsink Load Metrology
..........................................................................................85
E
Embedded Thermal Solutions
...................................................................................87
E.1
Performance Targets ..........................................................................................87
E.2
Thermal Design Guidelines..................................................................................88
E.2.1
NEBS Thermal Profile ..............................................................................88
E.2.2
Custom Heat Sinks For UP ATCA ...............................................................89
E.3
Mechanical Drawings and Supplier Information ......................................................92
F
Processor Installation Tool
......................................................................................97
Figures
1-1 Intel® Xeon® 5500 Platform Socket Stack ................................................................... 9
2-1 LGA1366 Socket with Pick and Place Cover Removed ....................................................13
2-2 LGA1366 Socket Contact Numbering (Top View of Socket) .............................................14
2-3 LGA1366 Socket Land Pattern (Top View of Board) .......................................................15
2-4 Attachment to Motherboard .......................................................................................16
2-5 Pick and Place Cover .................................................................................................17
2-6 Package Installation / Removal Features......................................................................18
2-7 LGA1366 NCTF Solder Joints ......................................................................................20
3-1 ILM Cover Assembly .................................................................................................22
3-2 Back Plate ...............................................................................................................23
3-3 ILM Assembly ..........................................................................................................24
3-4 Pin1 and ILM Lever ...................................................................................................25
4-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .................................30
5-1 1U Heatsink Performance Curves ................................................................................32
5-2 TTV Die Size and Orientation......................................................................................34
5-3 1U Reference Heatsink Assembly ................................................................................35
5-4 Processor Thermal Characterization Parameter Relationships ..........................................37
5-5 Dual Thermal Profile .................................................................................................38
6-1 Example Thermal Cycle - Actual profile will vary ...........................................................45
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4)...............................................................52
B-2 Board Keepin / Keepout Zones (Sheet 2 of 4)...............................................................53
B-3 Board Keepin / Keepout Zones (Sheet 3 of 4)...............................................................54
B-4 Board Keepin / Keepout Zones (Sheet 4 of 4)...............................................................55
B-5 1U Reference Heatsink Assembly (Sheet 1 of 2) ...........................................................56
B-6 1U Reference Heatsink Assembly (Sheet 2 of 2) ...........................................................57
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
