Thermal/Mechanical Design Guide
33
Thermal Solutions
5.1.1
25.5 mm Tall Heatsink
For the 25.5 mm tall heatsink,
Table 5-2
provides guidance regarding performance
expectations. These values are not used to generate processor thermal specifications.
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (
Section 5.5.1
).
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level
Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.
5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink socket/processor
height (7.729 mm,
Table 4-2
) complies with 33.5mm max height for SSI blade boards
(http://ssiforum.oaktree.com/).
6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.
Table 5-2.
Performance Expectations for 25.5 mm Tall Heatsink
Parameter
Value
Altitude, system
ambient temp
Sea level, 35
o
C
TDP
95W, Profile B
T
LA
1
50
o
C
49
o
C
40
o
C
Ψ
CA
2
0.287
o
C/W
0.337
o
C/W
0.275
o
C/W
Airflow
3
13.3 CFM @ 0.334” dP
10 CFM @ 0.210” dP
16 CFM @ 0.354” dP
System height
(form factor)
4
SSI blade
1U (EEB)
1U (TEB)
Heatsink
volumetric
90 x 90 x 25.5mm (1U)
5
Heatsink
technology
6
Cu base, Al fins
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
