Thermal/Mechanical Design Guide
23
Independent Loading Mechanism (ILM)
3.2
Assembly of ILM to a Motherboard
The ILM design allows a bottoms up assembly of the components to the board. In
step 1, (see
Figure 3-3
), the back plate is placed in a fixture. Holes in the motherboard
provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed
over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover
assembly to the back plate with the four captive fasteners. Torque to 8 ± 2 inch-
pounds. The length of the threaded studs accommodate board thicknesses from
0.062” to 0.100”.
Figure 3-2. Back Plate
Threaded studs
Threaded nuts
Clearance hole
Cu
t-
ou
t
Threaded studs
Threaded nuts
Clearance hole
Cu
t-
ou
t
Cu
t-
ou
t
Threaded studs
Clearance hole
Threaded nuts
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...