Thermal/Mechanical Design Guide
43
Quality and Reliability Requirements
6
Quality and Reliability
Requirements
6.1
Test Conditions
The Test Conditions provided in
Table 6-1
address processor heatsink failure
mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer;
Table 6-1
applies to Intel requirements.
Socket Test Conditions are provided in the LGA1366 Socket Validation Reports available
from socket suppliers listed in
Appendix A
.
Table 6-1.
Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)
Assessment
Test Condition
Qualification Criteria
Min
Sample
Size
1) Humidity
Non-operating, 500 hours, +85°C and 85%
R.H.
No visual defects.
As verified in wind tunnel:
• Mean
Ψ
CA
+ 3s + offset not to exceed
value in
Table 5-1
.
• Pressure drop not to exceed value in
Table 5-1
.
15
2) Board-Level
UnPackaged Shock
50G+/-10%; 170+/-10% in/sec; 3 drops
per face, 6 faces.
No damage to heatsink base or pipe.
No visual defects.
As verified in wind tunnel:
• Mean
Ψ
CA
+ 2.54s + offset not to
exceed value in
Table 5-1
.
• Pressure drop not to exceed value in
Table 5-1
.
15
3) Board-Level
UnPackaged Vibration
5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz
(slope up).
20 Hz to 500 Hz @ 0.02 g2/Hz (flat).
Input acceleration is 3.13 g RMS.
10 minutes/axis for all 3 axes on all
samples.
Random control limit tolerance is ±3 dB.
No damage to heatsink base or pipe.
No visual defects.
As verified in wind tunnel:
• Mean
Ψ
CA
+ 2.54s + offset not to
exceed value in
Table 5-1
• Pressure drop not to exceed value in
Table 5-1
15
4) First Article
Inspection
Not Applicable
Meet all dimensions on 5 samples.
Meet all CTF dimensions on 32 additional
samples with 1.33 Cpk (mean + 4s).
If samples are soft-tooled, a hard tool plan
must be defined.
37
5) Shipping Media:
Packaged Shock
Drop height determined by weight and may
vary by customer; Intel requirement in
General Supplier Packaging Spec.
10 drops (6 sides, 3 edges, 1 corner)
No visual defects
1 box
6) Shipping Media:
Packaged Vibration
0.015 g2/Hz @ 10-40 Hz, sloping to
0.0015 g2/Hz @ 500 Hz, 1.03 gRMS,
1 hour/axis for 3 axes
No visual defects
1 box
7) Gravitational
Evaluation
Required for heatpipe designs.
3 orientations (0°, +90°, -90°)
As verified in wind tunnel, mean
Ψ
CA
+ 3s
+ offset not to exceed value in
Table 5-1
15
Summary of Contents for Xeon 5500 Series
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 42: ...Thermal Solutions 42 Thermal Mechanical Design Guide ...
Page 50: ...Component Suppliers 50 Thermal Mechanical Design Guide ...
Page 78: ...Mechanical Drawings 78 Thermal Mechanical Design Guide ...
Page 84: ...Socket Mechanical Drawings 84 Thermal Mechanical Design Guide ...
